Patent Assignment
Reel/Frame 062516/0542
Assignment of Assignor's Interest
Recorded: 2023-01-27
Pages: 12
Assignors
TIEN, HSI-WEN
Executed: 2020-07-01
LIAO, WEI-HAO
Executed: 2020-07-01
YAO, HSIN-CHIEH
Executed: 2020-07-02
LU, CHIH-WEI
Executed: 2020-07-02
LEE, CHUNG-JU
Executed: 2020-07-02
DAI, YU-TENG
Executed: 2020-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, 30077, TAIWAN
Covered Property
(1)
Double Patterning Approach by Direct Metal Etch