Patent Assignment
Reel/Frame 062522/0991
Assignment of Assignor's Interest
Recorded: 2023-01-30
Pages: 3
Assignors
KUANG, SHIN-JIUN
Executed: 2021-05-10
LIN, MENG-YU
Executed: 2021-05-10
CHENG, CHUN-FU
Executed: 2021-05-10
WU, CHUNG-WEI
Executed: 2021-05-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Fabrication Thereof