Patent Assignment
Reel/Frame 062530/0107
Assignment of Assignor's Interest
Recorded: 2023-01-30
Pages: 4
Assignors
PAN, KUAN-TING
Executed: 2020-11-03
CHIANG, KUO-CHENG
Executed: 2020-11-03
JU, SHI-NING
Executed: 2020-11-03
JHAN, YI-RUEI
Executed: 2020-11-03
CHENG, KUAN-LUN
Executed: 2020-11-03
WANG, CHIH-HAO
Executed: 2020-11-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same