Assignment of Assignor's Interest

Recorded: 2023-01-30 Pages: 2

Assignors

YU, PING-LUNG

Executed: 2022-12-16

SHAO, PO-CHUN

Executed: 2022-12-16

HSIEH, CHU-CHUN

Executed: 2022-12-16

Assignee

WINBOND ELECTRONICS CORP.

NO. 8, KEYA 1ST RD.,DAYA DIST., CENTRAL TAIWAN SCIENCE PARK, TAICHUNG CITY, TAIWAN

Covered Property (1)

Doping Barrier Layer to Facilitate Metal Fill with Large Grain Size

Application: 18/089,773 →

Publication: US 2024/0222191