Patent Assignment
Reel/Frame 062541/0681
Assignment of Assignor's Interest
Recorded: 2023-01-31
Pages: 6
Assignors
CHOI, EUISUN
Executed: 2022-07-07
KIM, HUIJAE
Executed: 2022-07-06
LEE, MINGU
Executed: 2022-07-06
CHEONG, HYEONGGYUN
Executed: 2022-07-24
HONG, YUNPYO
Executed: 2022-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus for Bonding Chip Band and Method for Bonding Chip Using the Same