Patent Assignment
Reel/Frame 062546/0694
Assignment of Assignor's Interest
Recorded: 2023-01-31
Pages: 6
Assignors
VELOSO, ANABELA
Executed: 2023-01-04
BEYNE, ERIC
Executed: 2023-01-05
JOURDAIN, ANNE
Executed: 2023-01-03
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method of Producing an Integrated Circuit Chip Including a Back-Side Power Delivery Network