Patent Assignment
Reel/Frame 062554/0330
Assignment of Assignor's Interest
Recorded: 2023-01-31
Pages: 3
Assignors
CHIU, CHAO-WEI
Executed: 2022-09-18
LI, CHAO-WEI
Executed: 2022-09-18
LIN, HSIU-JEN
Executed: 2022-09-28
HSIEH, CHING-HUA
Executed: 2022-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Having Thermoelectric Cooler