Patent Assignment
Reel/Frame 062571/0257
Assignment of Assignor's Interest
Recorded: 2023-02-02
Pages: 4
Assignors
CHOU, CHIH-CHAO
Executed: 2023-01-30
CHIU, YI-HSUN
Executed: 2023-01-30
CHANG, SHANG-WEN
Executed: 2023-01-31
TSAI, CHING-WEI
Executed: 2023-01-30
WANG, CHIH-HAO
Executed: 2023-02-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Package with Integrated Chips
Application:
18/163,416 →
Publication:
US 2024/0266340