Patent Assignment
Reel/Frame 062574/0873
Assignment of Assignor's Interest
Recorded: 2023-02-02
Pages: 3
Assignors
WANG, CHIH-CHENG
Executed: 2022-12-07
WU, ZONG-EN
Executed: 2022-12-07
CHIU, YUN-CHENG
Executed: 2022-12-07
Assignee
GRAND PROCESS TECHNOLOGY CORPORATION
NO. 89, SEC. 6, ZHONGHUA RD., XIANGSHAN DIST., HSINCHU CITY, 30095, TAIWAN
Covered Property
(1)
Integrated Wafer Debonding and Cleaning Apparatus and Debonding and Cleaning Method