Patent Assignment
Reel/Frame 062577/0255
Assignment of Assignor's Interest
Recorded: 2023-02-02
Pages: 4
Assignors
ICHINOSEKI, KENTARO
Executed: 2023-02-01
KAWAMURA, KEIKO
Executed: 2023-01-31
NISHIWAKI, TATSUYA
Executed: 2023-01-31
OASA, KOHEI
Executed: 2023-01-31
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing Same
Application:
18/105,164 →
Publication:
US 2024/0097022