Patent Assignment
Reel/Frame 062581/0576
Assignment of Assignor's Interest
Recorded: 2023-02-03
Pages: 5
Assignors
SHEN, HSIANG-KU
Executed: 2022-10-06
WU, MAN-YUN
Executed: 2022-10-06
CHEN, WEN-TZU
Executed: 2022-10-23
CHANG, CHI-HAO
Executed: 2022-10-10
CHANG, WEN-LING
Executed: 2022-12-13
LIN, CHIA-NAN
Executed: 2022-10-06
YANG, SEAN
Executed: 2022-10-30
HUANG, CHEN-CHIU
Executed: 2022-10-06
CHEN, DIAN-HAO
Executed: 2022-10-10
LIN, CHING-WEI
Executed: 2022-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Low-Stress Passivation Layer
Application:
18/153,912 →
Publication:
US 2024/0136291