Patent Assignment
Reel/Frame 062582/0114
Assignment of Assignor's Interest
Recorded: 2023-02-03
Pages: 12
Assignors
LEE, JONGJIN
Executed: 2023-01-25
KIM, TAE SUN
Executed: 2023-01-25
HONG, WONHYUK
Executed: 2023-01-25
YUN, SEUNGCHAN
Executed: 2023-01-25
SEO, KANG-ILL
Executed: 2023-01-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including a Back Side Power Distribution Network Structure and Methods of Forming the Same