Patent Assignment
Reel/Frame 062585/0843
Assignment of Assignor's Interest
Recorded: 2023-02-03
Pages: 3
Assignor
EJIRI, YASUNORI
Executed: 2023-01-30
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium