Patent Assignment
Reel/Frame 062587/0553
Assignment of Assignor's Interest
Recorded: 2023-02-03
Pages: 3
Assignor
CHEN, CHIH-YANG
Executed: 2023-01-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Forming the Same
Application:
18/149,636 →
Publication:
US 2024/0222459