Patent Assignment
Reel/Frame 062616/0121
Assignment of Assignor's Interest
Recorded: 2023-02-07
Pages: 3
Assignors
PAN, KUAN-TING
Executed: 2022-10-27
CHIANG, KUO-CHENG
Executed: 2022-10-27
JU, SHI NING
Executed: 2022-10-24
CHANG, CHIA-HAO
Executed: 2022-11-01
WANG, CHIH-HAO
Executed: 2022-10-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing Thereof
Application:
18/106,724 →
Publication:
US 2024/0154014