Patent Assignment
Reel/Frame 062623/0722
Assignment of Assignor's Interest
Recorded: 2023-02-08
Pages: 6
Assignors
KIM, JI HYUNG
Executed: 2023-01-09
OH, JAE HEE
Executed: 2023-01-06
HWANG, JE GWAN
Executed: 2023-01-05
AHN, JEONG HOON
Executed: 2023-01-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device having a Source/Drain Contact Connected to a Back-Side Power Rail by a Landing Pad and a Through Electrode