Patent Assignment
Reel/Frame 062629/0401
Assignment of Assignor's Interest
Recorded: 2023-02-08
Pages: 4
Assignors
CHEN, HSIAO LU
Executed: 2023-01-16
LIU, AI SEN
Executed: 2023-01-16
FENG, HSIANG AN
Executed: 2023-01-16
CHEN, YA LI
Executed: 2023-01-16
Assignee
INGENTEC CORPORATION
NO.58, LN. 462, GONGYI RD., ZHUNAN TOWNSHIP, MIAOLI COUNTY, 350, TAIWAN
Covered Property
(1)
Via-Filling Method of Through-Glass via Substrate