Patent Assignment
Reel/Frame 062631/0185
Assignment of Assignor's Interest
Recorded: 2023-02-08
Pages: 6
Assignors
CHEONG, YOUNGHUN
Executed: 2023-01-27
CHO, MINCHUL
Executed: 2023-01-27
HAN, CHEOLSOO
Executed: 2023-01-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Application:
18/166,322 →
Publication:
US 2024/0023346