Patent Assignment
Reel/Frame 062633/0022
Assignment of Assignor's Interest
Recorded: 2023-02-08
Pages: 2
Assignor
MIZUTA, YOSHIO
Executed: 2023-02-07
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Bonding Apparatus, Bonding Method, and Method of Manufacturing Semiconductor Device
Application:
18/166,408 →
Publication:
US 2023/0411197