Patent Assignment
Reel/Frame 062634/0085
Assignment of Assignor's Interest
Recorded: 2023-02-09
Pages: 11
Assignors
YU, TA-JEN
Executed: 2023-01-18
LIN, SHIH-CHIN
Executed: 2023-01-18
CHEN, TAI-YU
Executed: 2023-01-18
YANG, BO-JIUN
Executed: 2023-01-30
LIN, BING-YEH
Executed: 2023-01-18
HUANG, YUNG-CHENG
Executed: 2023-01-30
HSU, WEN-SUNG
Executed: 2023-01-18
MA, BO-HAO
Executed: 2023-01-31
SONG, ISABELLA
Executed: 2023-01-18
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Semiconductor Package Having a Thick Logic Die
Application:
18/107,520 →
Publication:
US 2023/0282625