IP Library › Assignment 062645/0351
Patent Assignment
Reel/Frame 062645/0351

Assignment of Assignor's Interest

Recorded: 2023-02-09 Pages: 4
Assignors
TSAI, YA-YI
Executed: 2020-10-19
CHANG, CHI-HSIANG
Executed: 2020-10-19
LIN, SHIH-YAO
Executed: 2020-10-19
WANG, TZU-CHUNG
Executed: 2020-10-19
KU, SHU-YUAN
Executed: 2020-10-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Multi-Layer Dielectric Refill for Profile Control in Semiconductor Devices
Application: 18/166,896 →
Publication: US 2023/0187542