Patent Assignment
Reel/Frame 062647/0883
Assignment of Assignor's Interest
Recorded: 2023-02-10
Pages: 4
Assignors
LIANG, CHUN-SHENG
Executed: 2022-10-10
CHIEN, YU-SAN
Executed: 2022-10-17
SHEN, PIN CHUN
Executed: 2022-10-10
HONG, WEN-CHIANG
Executed: 2022-10-10
YEUNG, CHUN-WING
Executed: 2022-10-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/161,742 →
Publication:
US 2024/0128267