Patent Assignment
Reel/Frame 062661/0880
Assignment of Assignor's Interest
Recorded: 2023-02-10
Pages: 3
Assignors
HSIA, HSING-KUO
Executed: 2023-01-04
YU, CHEN-HUA
Executed: 2023-01-24
CHAO, JUI LIN
Executed: 2023-01-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Packages With Photonic Engines and Method of Forming the Same
Application:
18/151,044 →
Publication:
US 2024/0094469