Patent Assignment
Reel/Frame 062670/0994
Assignment of Assignor's Interest
Recorded: 2023-02-13
Pages: 3
Assignors
TSAI, KUO-CHIANG
Executed: 2023-02-10
YEH, JENG-YA
Executed: 2023-02-12
CHIANG, MU-CHI
Executed: 2023-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure with Conductive via Structure and Method for Forming the Same
Application:
18/167,944 →
Publication:
US 2024/0274525