Patent Assignment
Reel/Frame 062673/0289
Change of Name
Recorded: 2023-02-07
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Moisture-Curable Reactive Hot-Melt Adhesive Composition and Method for Producing the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 25, 2018
From: KURAMOCHI, CHIKA; KOMIYA, SOUICHIROU; MAGOME, KAZUYUKI; SUZUMURA, KOHJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047307/0282 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →