Patent Assignment
Reel/Frame 062676/0711
Assignment of Assignor's Interest
Recorded: 2023-02-13
Pages: 4
Assignors
TOKUYAMA, SHUHEI
Executed: 2023-02-09
KACHI, TSUYOSHI
Executed: 2023-02-06
NISHIGUCHI, TOSHIFUMI
Executed: 2023-02-06
KATOU, HIROAKI
Executed: 2023-02-06
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Semiconductor Device Having a Structure in Which a Field Plate Electrode and a Gate Electrode Are Buried in Different Trenches
Application:
18/168,243 →
Publication:
US 2024/0096972