Patent Assignment
Reel/Frame 062719/0152
Assignment of Assignor's Interest
Recorded: 2023-02-16
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Metal Pattern Layer with Open Region Which Overlaps Non-Contact Pad
Application:
18/110,472 →
Publication:
US 2023/0260889