Patent Assignment
Reel/Frame 062724/0651
Assignment of Assignor's Interest
Recorded: 2023-02-16
Pages: 4
Assignors
LIN, TA-CHUN
Executed: 2022-12-28
TSAI, MING-HENG
Executed: 2023-01-08
CHANG, HUANG-CHAO
Executed: 2022-12-28
LIANG, CHUN-SHENG
Executed: 2022-12-28
CHANG, CHIH-HAO
Executed: 2023-01-08
LIAW, JHON JHY
Executed: 2022-12-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with High Integration Density and Method for Manufacturing the Same