Patent Assignment
Reel/Frame 062730/0628
Assignment of Assignor's Interest
Recorded: 2022-12-14
Pages: 6
Assignors
LEE, KANGGYUNE
Executed: 2022-07-07
BAEK, HYUNGGIL
Executed: 2022-07-07
KIM, YOUNGJA
Executed: 2022-07-07
LEE, SEUNGJIN
Executed: 2022-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board Having Cutting Position Identification Mark and Alignment Mark and Semiconductor Package Having the Same