Patent Assignment
Reel/Frame 062734/0296
Assignment of Assignor's Interest
Recorded: 2023-02-17
Pages: 3
Assignor
WU, YI-HUA
Executed: 2023-02-06
Assignee
PANELSEMI CORPORATION
15F., NO.207, SEC 3, BEIXIN RD., XINDIAN DIST., NEW TAIPEI CITY, 231, TAIWAN
Covered Property
(1)
Resilient Substrate Structure and Electronic Device Having the Same