Assignment of Assignor's Interest

Recorded: 2023-02-21 Pages: 4

Assignor

DIXIT, ABHINANDAN

Executed: 2023-01-24

Assignee

GAN SYSTEMS INC.

SUITE 201, 770 PALLADIUM DRIVE, KANATA, K2V 1C8, CANADA

Covered Property (1)

Edge-Structured Leadframe for Embedded Die Packaging of Power Semiconductor Devices

Application: 18/085,684 →

Publication: US 2024/0213125

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.