Patent Assignment
Reel/Frame 062755/0757
Assignment of Assignor's Interest
Recorded: 2023-02-21
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Air Gap and Method for Manufacturing the Same