Patent Assignment
Reel/Frame 062758/0265
Assignment of Assignor's Interest
Recorded: 2023-02-21
Pages: 7
Assignors
LEE, DOOHYUN
Executed: 2023-01-26
SHIN, HEONJUNG
Executed: 2023-01-26
KIM, SEON-BAE
Executed: 2023-01-26
JANG, JAERAN
Executed: 2023-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Mosfet Semiconductor Device and Method of Manufacturing the Same
Application:
18/112,312 →
Publication:
US 2024/0030345