Patent Assignment
Reel/Frame 062763/0758
Assignment of Assignor's Interest
Recorded: 2023-02-22
Pages: 4
Assignors
LI, YU-JIN
Executed: 2023-02-21
YANG, BO-JIUN
Executed: 2023-02-21
CHEN, TAI-YU
Executed: 2023-02-21
PAN, TSUNG-YU
Executed: 2023-02-21
LIN, CHUN-YIN
Executed: 2023-02-21
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD. , HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
18/172,409 →
Publication:
US 2023/0197667