Patent Assignment
Reel/Frame 062764/0204
Assignment of Assignor's Interest
Recorded: 2023-02-22
Pages: 3
Assignors
HSIAO, TSUNG-CHIEH
Executed: 2022-10-03
WANG, LIANG-WEI
Executed: 2022-10-04
CHEN, DIAN-HAU
Executed: 2022-10-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Via Structure and Method for Forming the Same
Application:
18/172,420 →
Publication:
US 2024/0145344