Patent Assignment
Reel/Frame 062789/0719
Assignment of Assignor's Interest
Recorded: 2023-02-23
Pages: 3
Assignor
SHINDO, TAKEHIRO
Executed: 2023-02-07
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing System and Substrate Transfer Method
Application:
18/113,374 →
Publication:
US 2023/0282503