Patent Assignment
Reel/Frame 062797/0837
Assignment of Assignor's Interest
Recorded: 2023-02-24
Pages: 7
Assignors
SONG, YUJUNG
Executed: 2023-02-08
KIM, SUNGRAE
Executed: 2023-02-08
KANG, GILYOUNG
Executed: 2023-02-08
KIM, HYERAN
Executed: 2023-02-08
OH, CHISUNG
Executed: 2023-02-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device Including an on-Die Ecc Engine