Patent Assignment
Reel/Frame 062821/0395
Assignment of Assignor's Interest
Recorded: 2023-02-28
Pages: 3
Assignors
CHEN, XIANMING
Executed: 2023-02-20
FENG, JINDONG
Executed: 2023-02-20
HUANG, BENXIA
Executed: 2023-02-20
HUANG, GAO
Executed: 2023-02-20
HUANG, JUCHEN
Executed: 2023-02-20
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD
FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI,, GUANGDONG,, 519175, CHINA
Covered Property
(1)
Carrier Plate for Preparing Package Substrate, Package Substrate Structure and Manufacturing Method Thereof