Patent Assignment
Reel/Frame 062823/0151
Assignment of Assignor's Interest
Recorded: 2023-02-28
Pages: 4
Assignors
LI, LU
Executed: 2020-08-26
VISWANATHAN, LAKSHMINARAYAN
Executed: 2020-08-26
VAN STRATEN, FREEK EGBERT
Executed: 2020-08-26
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Methods of Fabricating Substrates with Thermal Vias and Sinter-Bonded Thermal Dissipation Structures