IP Library Assignment 062839/0084
Patent Assignment
Reel/Frame 062839/0084

Assignment of Assignor's Interest

Recorded: 2023-03-01 Pages: 4
Assignors
NGWAN, VOON CHENG
Executed: 2023-01-19
YIM, CHURN WENG
Executed: 2023-01-19
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Split-Gate Trench Power Mosfet with Thick Poly-to-Poly Isolation
Application: 63/449,092 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2023
From: ENEA, VINCENZO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 062839/0196 →
Assignment of Assignor's Interest Mar 27, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 066957/0012 →
Assignment of Assignor's Interest Apr 16, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 067119/0556 →