Patent Assignment
Reel/Frame 067119/0556
Assignment of Assignor's Interest
Recorded: 2024-04-16
Pages: 6
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2024-03-14
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(13)
Substrateless Chip Scale Optical Sensor Package
Application:
63/447,971 →
Substrateless Chip Scale Optical Sensor Package
Application:
18/415,231 →
Publication:
US 2024/0290807
Split-Gate Trench Power Mosfet with Thick Poly-to-Poly Isolation
Application:
63/449,092 →
Split-Gate Trench Power Mosfet with Thick Poly-to-Poly Isolation
Application:
18/428,306 →
Publication:
US 2024/0297240
Hybrid Multi-Die Qfp-Qfn Package
Application:
63/449,366 →
Method for Manufacturing a Hybrid Multi-Die Qfp-Qfn Package
Application:
18/441,210 →
Publication:
US 2024/0297147
Hybrid Quad Flat No-Leads (Qfn) Integrated Circuit Package
Application:
63/455,388 →
Hybrid Quad Flat No-Leads (Qfn) Integrated Circuit Package
Application:
18/429,009 →
Publication:
US 2024/0332143
Gate Contact Structure for a Trench Power Mosfet with a Split Gate Configuration
Application:
63/469,927 →
Optical Sensor Package with Light Shielding Material
Application:
63/492,983 →
Optical Sensor Package with Light Shielding Material
Application:
63/492,987 →
Multi-Axis Laser Drilling for Wafer-Level Packaging
Application:
63/509,312 →
Semiconductor Packaging with Embedded Emf Shielding Protection Using Wire Bonding
Application:
63/521,247 →
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 24, 2023
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 062794/0031 →
Assignment of Assignor's Interest
Mar 1, 2023
From: NGWAN, VOON CHENG; YIM, CHURN WENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 062839/0084 →
Assignment of Assignor's Interest
Mar 1, 2023
From: ENEA, VINCENZO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 062839/0196 →
Assignment of Assignor's Interest
Mar 2, 2023
From: LOO, SHEI MENG; DE JESUS, EDSEL
To: STMICROELECTRONICS PTE LTD
Reel/Frame 062854/0753 →
Assignment of Assignor's Interest
Mar 29, 2023
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 063151/0954 →
Assignment of Assignor's Interest
May 25, 2023
From: GANI, DAVID
To: STMICROELECTRONICS PTE LTD
Reel/Frame 063768/0069 →
Assignment of Assignor's Interest
May 25, 2023
From: KUO, YIYING; WANG, HUI-TZU
To: STMICROELECTRONICS LTD
Reel/Frame 063768/0077 →
Assignment of Assignor's Interest
May 31, 2023
From: CASTORINA, MAURIZIO GABRIELE; NGWAN, VOON CHENG
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 063808/0157 →
Assignment of Assignor's Interest
Jun 21, 2023
From: LOO, SHEI MENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 064011/0269 →
Assignment of Assignor's Interest
Jul 9, 2023
From: RENARD, LOIC PIERRE LOUIS
To: STMICROELECTRONICS PTE LTD
Reel/Frame 064192/0438 →
Assignment of Assignor's Interest
Jul 10, 2023
From: GANI, DAVID
To: STMICROELECTRONICS PTE LTD
Reel/Frame 064198/0142 →
Assignment of Assignor's Interest
Jul 10, 2023
From: WANG, HUI-TZU; KUO, YIYING
To: STMICROELECTRONICS LTD
Reel/Frame 064198/0148 →
Quitclaim
Sep 29, 2023
From: STMICROELECTRONICS INTERNATIONAL N.V.
To: STMICROELECTRONICS PTE LTD
Reel/Frame 065084/0961 →
Assignment of Assignor's Interest
Oct 4, 2023
From: CASTORINA, MAURIZIO GABRIELE; NGWAN, VOON CHENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 065122/0836 →
Assignment of Assignor's Interest
Mar 27, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 066957/0012 →
Assignment of Assignor's Interest
Apr 16, 2024
From: STMICROELECTRONICS LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 067119/0562 →