IP Library Assignment 062854/0753
Patent Assignment
Reel/Frame 062854/0753

Assignment of Assignor's Interest

Recorded: 2023-03-02 Pages: 3
Assignors
LOO, SHEI MENG
Executed: 2023-02-09
DE JESUS, EDSEL
Executed: 2023-02-09
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Hybrid Multi-Die Qfp-Qfn Package
Application: 63/449,366 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 16, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 067119/0556 →