IP Library › Patent Application 63521247
Patent Application Provisional
App. No. 63/521,247 · Confirmation No. 5763

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USING WIRE BONDING

Provisional Application Expired
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 Code Description Pages PDF
2023-07-09 OATH Oath or Declaration filed 1 View
2023-07-09 N417 Electronic Filing System Acknowledgment Receipt 2 View
2023-06-29 APP.FILE.REC Filing Receipt 3 View
2023-06-15 PA.. Power of Attorney 3 View
2023-06-15 DRW Drawings-only black and white line drawings 9 View
2023-06-15 SPEC Specification 15 View
2023-06-15 CLM Claims 4 View
2023-06-15 ABST Abstract 1 View
2023-06-15 ADS Application Data Sheet 8 View
2023-06-15 WFEE Fee Worksheet (SB06) 2 View
2023-06-15 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
63/521,247
Filed
2023-06-15