Assignment of Assignor's Interest

Recorded: 2023-06-21 Pages: 4

Assignor

LOO, SHEI MENG

Executed: 2023-06-05

Assignee

STMICROELECTRONICS PTE LTD

28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE

Covered Property (1)

Multi-Axis Laser Drilling for Wafer-Level Packaging

Application: 63/509,312 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.