IP Library › Patent Application 63447971
Patent Application Provisional
App. No. 63/447,971 · Confirmation No. 2074

SUBSTRATELESS CHIP SCALE OPTICAL SENSOR PACKAGE

Inventor: Jing-En LUAN
Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2023-03-07 APP.FILE.REC Filing Receipt 3 View
2023-02-24 PA.. Power of Attorney 2 View
2023-02-24 OATH Oath or Declaration filed 1 View
2023-02-24 WFEE Fee Worksheet (SB06) 2 View
2023-02-24 N417 Electronic Filing System Acknowledgment Receipt 3 View
2023-02-24 ADS Application Data Sheet 7 View
2023-02-24 TR.PROV Provisional Cover Sheet (SB16) 3 View
2023-02-24 SPEC Specification 11 View
2023-02-24 CLM Claims 6 View
2023-02-24 ABST Abstract 1 View
2023-02-24 DRW Drawings-only black and white line drawings 6 View
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Quick Facts
App. No.
63/447,971
Filed
2023-02-24