Patent Assignment
Reel/Frame 062863/0510
Assignment of Assignor's Interest
Recorded: 2023-03-02
Pages: 3
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Adhesive Agent for Semiconductors, and Semiconductor Device and Method for Manufacturing Same
Application:
18/043,731 →
Publication:
US 2023/0348764
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.