IP Library › Assignment 062872/0872
Patent Assignment
Reel/Frame 062872/0872

Assignment of Assignor's Interest

Recorded: 2023-03-03 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2016-08-22
CARNEY, FRANCIS J.
Executed: 2016-08-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property (1)
Through-Substrate via Structure and Method of Manufacture
Application: 18/177,953 →
Publication: US 2024/0297106
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 9, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 065402/0293 →
Release of Security Interest in Patents Recorded at Reel 064502, Frame 0293 Nov 14, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 065566/0488 →