Patent Assignment
Reel/Frame 062873/0426
Assignment of Assignor's Interest
Recorded: 2023-03-03
Pages: 11
Assignors
SHIBAZAKI, SHUNICHIRO
Executed: 2023-01-31
HOSHINO, KOZO
Executed: 2023-01-31
YUZUKI, SHINICHI
Executed: 2023-01-31
NAKAGAWA, TETSUYA
Executed: 2023-01-31
SAITO, KIYOHIRO
Executed: 2023-01-31
SHISHIDO, YUTA
Executed: 2023-01-31
KOBAYASHI, KAZUMI
Executed: 2023-01-31
WATANABE, NOBUYUKI
Executed: 2023-01-31
HOSHINO, MASAKI
Executed: 2023-01-31
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Camera Module and Electronic Device with Heat Dissipating Member