Patent Assignment
Reel/Frame 062884/0629
Assignment of Assignor's Interest
Recorded: 2023-03-05
Pages: 3
Assignor
FAN, ZENGYAN
Executed: 2022-10-28
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA, HEFEI, ANHUI, 230601, CHINA
Covered Property
(1)
Chip Packaging Structure and Method for Preparing the Same, and Method for Packaging Semiconductor Structure