Patent Assignment
Reel/Frame 062893/0924
Assignment of Assignor's Interest
Recorded: 2022-12-16
Pages: 3
Assignee
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
9 DONGSHENG WEST ROAD, JIANGYIN CITY, JIANGSU PROVINCE, 214437, CHINA
Covered Property
(1)
Three-Dimensional Fan-Out Integrated Package Structure, Packaging Method Thereof, and Wireless Headset
Application:
17/989,224 →
Publication:
US 2023/0163114